Highly Polished Sapphire Slice 0.5mm-3mm Thickness 2inch-8inch Diameter
Product Description:
Sapphire Wafer is a kind of high precision sapphire platelet, which is made by cutting and grinding of high quality sapphire single crystal. It has the characteristics of bow and warp ≤ 20μm, TTV ≤ 3μm, clear aperture > 90%, diameter range from 2inch to 8inch, and perpendicularity ≤ 3 Arc Min. It is widely used in the fields of optical, electronic, aerospace, medical, and other industries, and can be used to manufacture various sapphire optical components.
Features:
- Product Name: Sapphire Wafer
- Clear Aperture: >90%
- Orientation: ±0.5°
- Surface Roughness: Ra<0.2nm
- Perpendicularity: ≤3 Arc Min
- Size: Customized
- Material: Sapphire Plate, Sapphire Plate, Sapphire Slice
Technical Parameters:
| Sapphire Wafer |
| Item | 2 Inch | 4 Inch | 6 Inch |
| Crystal | LED Grade Sapphire | LED Grade Sapphire | LED Grade Sapphire |
| Purity | >99.998% | >99.998% | >99.998% |
| Color | Transparent | Transparent | Transparent |
| Orientation | C plane tiled M axis 0.20°±0.1° | C plane tiled M axis 0.20°±0.1° | C plane tiled M axis 0.20°±0.1° |
| Diameter | 50.8±0.1mm | 100±0.2mm | 150±0.2mm |
| Thickness | 430±15um | 650±25um | 1300±25um |
| PF Location | A-axist±0.2° | A-axist±0.2° | A-axist±0.2° |
| Flat Length | 16.0±1.0mm | 30.0±1.0mm | 49.0±1.0mm |
| Front Side Surface | Mirror polished EPI-Ready | Mirror polished EPI-Ready | Mirror polished EPI-Ready |
| Surface Roughness | Ra<3A | Ra<3A | Ra<3A |
| Back Side Roughness | Fine ground, Ra=1.0±0.2um | Fine ground, Ra=1.0±0.2um | Fine ground, Ra=1.0±0.2um |
| TTV | <5.0um | <10um | <15um |
| BOW | 0~-5um | 0~-10um | 0~-30um |
| Warp | <10um | <15um | <40um |
| Bubble& Color | None by visual inspection in fluorescent light |
| Cleanliness | Free visible contamination |
| Packaging | Vacuum packed in one-piece box or Entegris cassettes of 25 |
Applications:
BonTek's SAP sapphire wafer is ideal for a variety of applications. With a certification of ISO:9001, and a minimum order quantity of 10 pcs, this sapphire wafer offers high quality at an affordable price of $60.00/ea. Each wafer is packaged in a cassette and vacuum sealed to preserve its quality. Delivery time for this product is 2~4 weeks, and payment terms are TT/in advance. With a supply ability of 10000 pcs, this sapphire wafer offers high performance with its clear aperture of >90%, surface quality of single side polished, edge grinding of roundness, and thickness of 0.5mm-3mm with an orientation of ±0.5°.
Customization:
Sapphire Wafer
Brand Name: BonTek
Model Number: SAP
Place of Origin: China
Certification: ISO:9001
Minimum Order Quantity: 10 pcs
Price: $60.00/ea
Packaging Details: Cassette, vacuum sealed
Delivery Time: 2~4 weeks
Payment Terms: TT/in advance
Supply Ability: 10000 pcs
Sapphire Slice, Sapphire Substrate, Sapphire Wafer
- Parallelism: ≤3 Arc Sec
- Orientation: ±0.5°
- Material: Sapphire
- Edge Grinding: Roundness
- Perpendicularity: ≤3 Arc Min
Packing and Shipping:
Sapphire Wafer Packaging and Shipping
Sapphire Wafer will be packaged in accordance with the customer's individual requirements. It is typically shipped in a foam-lined box to protect against shock and vibration. The box will be labeled with the product name, part number, date of shipment, and the company's name. The package will also be securely sealed with the appropriate shipping tape.
For international shipments, Sapphire Wafer will be shipped via airfreight with the appropriate customs documentation. All shipments will be tracked and monitored to ensure safe delivery.
